Board Level Reliability of Flipchip Package
نویسندگان
چکیده
In the world of electronic materials, solder is a critical material that plays an important role in first level (silicon to package substrate) and second (package printed circuit board) interconnection. As joining assemblies, provides electrical mechanical connections. The increasing need for reliable devices harsh environment triggers joints. This study focuses on reliability interconnections between boards. Board temperature cycling drop performance 15 mm x FCBGA test vehicle were evaluated with different construction (lidded vs non-lidded), BGA alloys (SA1, SA2, SA3). Daisy chain packages assembled 1.0 thick PCB. Mounted units thermally cycled from -40C 125C. Additional samples conditions following JEDEC standards. Results showed SA3 had significantly higher board-level thermal life compared SA1. best was achieved SA1 solder. trend among found be similar lidded non package. However, improved non-lidded
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ژورنال
عنوان ژورنال: IMAPS symposia and conferences
سال: 2023
ISSN: ['2380-4505']
DOI: https://doi.org/10.4071/001c.74741